TSMC Reportedly Mulls Advanced Chip Packaging Facility in Arizona
TSMC is in talks with Arizona officials to build its chip packaging facility in the state, Katie Hobbs, governor of Arizona, said in Taipei after visiting the world’s […]
Tag: GPUs
Nvidia’s Next-Gen Blackwell GPUs Rumored to Use Multi-Chiplet Design
Unlike its rivals AMD and Intel, Nvidia yet has to implement a multi-chiplet design for high-performance compute GPUs, but it looks like […]
Intel’s Glass Substrates Advancements Could Revolutionize Multi-Chiplet Packages
Intel today formally confirmed that it would use glass substrates for advanced packaging in the second half of this decade. Intel expects […]